Weicon Contact Gel, W137470, 20GM

Weicon

Discover the exceptional features of our premium Weicon Contact Gel, W137470, 20GM from the renowned collection. Expertly crafted for excellence in the Industrial Adhesives category, this top-tier product sets new industry standards. Experience the unmatched quality and innovation that define our Weicon Contact Gel, W137470, 20GM.
 
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62.00 د.إ

Product Specifications

BrandWeicon
Application

It is suited for the bonding of the most diverse products, hobby sector and in model building.

Colour

Colourless

Direction To Use

Apply only on one of the surfaces to be bonded. The bond line should be between 0.05 mm and max. 0.2 mm (acc. to type) in thickness.

Model

W137470

Size

20 g

Storage Temperature (deg C)

18 to 25 deg C

Temperature Resistance

-50 to 80 deg C

Tensile Strength

8-21 N/sq m

Viscosity

60-90 mPa

Brand

Product Specifications

BrandWeicon
Application

It is suited for the bonding of the most diverse products, hobby sector and in model building.

Colour

Colourless

Direction To Use

Apply only on one of the surfaces to be bonded. The bond line should be between 0.05 mm and max. 0.2 mm (acc. to type) in thickness.

Model

W137470

Size

20 g

Storage Temperature (deg C)

18 to 25 deg C

Temperature Resistance

-50 to 80 deg C

Tensile Strength

8-21 N/sq m

Viscosity

60-90 mPa

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